The University of León, as part of the European Digital Innovation Hub DIGIS3, has strengthened its commitment to digital transformation and business training through an innovative course designed for VEXIZA’s staff, one of the leading companies in GIS (Geographic Information System) solutions.
The training, delivered at the School of Industrial, Computer, and Aerospace Engineering at ULE, featured experts from the SECOMUCI Research Group. The primary goal of the course was to enhance skills in data analysis, cybersecurity, and artificial intelligence—crucial areas for today’s business environment.
The course was led by a team of instructors: Natalia Prieto Fernández, José Alberto Benítez Andrades, Sergio Rubio Martín, Martín Bayón Gutiérrez, and José Aveleira Mata, who provided valuable insights and practical tools tailored to VEXIZA’s specific needs.
Over the course of several sessions, participants explored techniques for analysing large datasets, strategies to safeguard business systems against cyber threats, and methods for integrating artificial intelligence into internal processes to optimise resources and improve decision-making.
This training initiative is part of DIGIS3's efforts to drive the digital transformation of SMEs, large companies, and public administrations across the region. The initiative has been met with enthusiasm from both sides and further solidifies ULE’s position as a leader in innovation and technological training in Castilla y León. The University of León highlights the importance of forging strategic partnerships with companies such as VEXIZA to address digitalisation challenges and strengthen the regional business landscape.
About DIGIS3
DIGIS3 is a European Digital Innovation Hub (EDIH) supported by the European Commission. The consortium focuses on fostering cohesion through comprehensive support for users, helping them access specialised technical knowledge and experimental environments. It functions as a one-stop digital service, with its core expertise in Trustworthy Artificial Intelligence, High-Performance Computing, and Advanced Digital Skills (IoT, 5G, additive manufacturing, etc.).